As a Signal and Power Integrity Engineer, you'll develop packaging solutions for chiplet interconnects, optimizing performance through simulation, measurement, and collaboration with cross-functional teams.
Join the leading chiplet startup from the ground floor! As a Signal and Power Integrity Engineer, you will provide packaging solutions for chiplet interconnects in a fast-paced early-stage startup creating technologies that fuel tomorrow’s chiplet-based systems with best-in-class power, area, manufacturability, and design flexibility. You will be responsible for design, modeling, manufacturing, assembly, and testing of traditional and advanced packaging for Eliyan’s chiplet solutions. You will work with a cross-functional team of industry experts that operate from first principles, innovate and push the envelope to create high-volume and high-performance manufacturable products. We offer a fun work environment with excellent benefits.
Key Responsibilities
- Working closely with analog circuit designers to understand and define IO requirements co-designed with the channel
- Responsible for pre-layout and post layout channel simulation and optimization to achieve the best performance
- Using driver/receiver models to run transient channel simulation, inspect eye diagrams, and improve the performance
- Applying best practices for the design of power delivery networks, extracting models, and performing DC/AC/transient simulations
- Understanding substrate and interposer manufacturing design rules, assembly requirements, and driving the layout engineers to implement them
- Performing measurements in the lab, correlating with simulation, identifying issues and providing solutions
Qualifications
- Expertise in signal integrity and power integrity simulation methodologies
- Experience with simulation tools such as HFSS, Q3D, Siwave, PowerDC, PowerSI, ADS, Spectre, HSPICE, Allegro
- Knowledge of using lab equipment such as Vector Network Analyzer, Spectrum Analyzer, High-Frequency Oscilloscope
- BS degree in EE or equivalent, with 5 years of experience
- Will not relocate for this role a this time and onsite required
Ideal Qualifications
- Previous experience of IC packaging, manufacturing, and advanced package design
- Knowledge of SERDES design, IBIS-AMI model creation
- MS degree in EE or equivalent, with 7 years of experience
Top Skills
Ads
Allegro
Hfss
Hspice
Powerdc
Powersi
Q3D
Siwave
Spectre
Similar Jobs
Artificial Intelligence • Cloud • Consumer Web • Productivity • Software • App development • Data Privacy
The Principal Product Manager will lead the strategy and execution for Dropbox's Teams and Collaboration experience, focusing on alignment across multiple product streams, delivering growth, and mentoring other PMs.
Top Skills:
B2BCollaboration ToolsCommunications ToolsProductivity ToolsSaaSWorkflow Tools
Artificial Intelligence • Cloud • Consumer Web • Productivity • Software • App development • Data Privacy
The Senior Data Scientist will leverage data-driven insights to guide product roadmaps, build foundational tools for AI/ML growth, and communicate findings effectively to influence business decisions.
Top Skills:
PythonSQL
Artificial Intelligence • Cloud • Consumer Web • Productivity • Software • App development • Data Privacy
The job responsibilities and requirements are currently to be determined (TBD).
What you need to know about the Montreal Tech Scene
With roots dating back to 1642, Montreal is often recognized for its French-inspired architecture and cobblestone streets lined with traditional shops and cafés. But what truly sets the city apart is how it blends its rich tradition with a modern edge, reflected in its evolving skyline and fast-growing tech industry. According to economic promotion agency Montréal International, the city ranks among the top in North America to invest in artificial intelligence, making it le spot idéal for job seekers who want the best of both worlds.
Key Facts About Montreal Tech
- Number of Tech Workers: 255,000+ (2024, Tourisme Montréal)
- Major Tech Employers: SAP, Google, Microsoft, Cisco
- Key Industries: Artificial intelligence, machine learning, cybersecurity, cloud computing, web development
- Funding Landscape: $1.47 billion in venture capital funding in 2024 (BetaKit)
- Notable Investors: CIBC Innovation Banking, BDC Capital, Investissement Québec, Fonds de solidarité FTQ
- Research Centers and Universities: McGill University, Université de Montréal, Concordia University, Mila Quebec, ÉTS Montréal
