Tenstorrent Inc.
Lead Signal Integrity and Power Integrity (SIPI) Package Engineer
Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities.
Tenstorrent is seeking a dynamic Lead Signal Integrity/Power Integrity Packaging Engineer to drive signal and power integrity excellence for our advanced chiplet-based AI hardware. In this role, you will architect robust high-performance package designs, and champion innovative solutions for next-generation AI systems. If you're passionate about pushing the boundaries of SIPI design and want to shape the future of AI hardware through technical leadership, we want to hear from you.
This role is hybrid, based in Toronto, ON, or Austin, TX.
We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting.
Who You Are
- An experienced SIPI leader with 10+ years designing for high-power, high-speed electronic systems.
- A technical mentor who builds high-performing teams and fosters cultures of excellence and innovation.
- A strategic thinker comfortable navigating ambiguity while driving clarity in dynamic environments.
- An excellent communicator who collaborates seamlessly across disciplines and presents confidently to leadership.
What We Need
- Minimum 10 years of signal and power integrity analysis experience, ideally with chiplet-based or AI/HPC systems.
- Deep expertise in SIPI fundamentals and proficiency with industry-standard simulation tools.
- Proven leadership experience mentoring engineers and delivering complex SIPI designs on schedule.
- Strong problem-solving abilities with experience in advanced packaging technologies (2.5D/3D ICs, chiplets).
What You Will Learn
- How to architect SIPI solutions for cutting-edge chiplet-based AI accelerators at unprecedented scale.
- Advanced methodologies for optimizing power delivery and signal integrity in next-generation packaging.
- Leadership strategies for building world-class engineering teams in a fast-paced innovation environment.
- Direct influence on technology roadmaps through proof-of-concept projects and cross-functional collaboration.
Compensation for all engineers at Tenstorrent ranges from $100k - $500k including base and variable compensation targets. Experience, skills, education, background and location all impact the actual offer made.
Tenstorrent offers a highly competitive compensation package and benefits, and we are an equal opportunity employer.
This offer of employment is contingent upon the applicant being eligible to access U.S. export-controlled technology. Due to U.S. export laws, including those codified in the U.S. Export Administration Regulations (EAR), the Company is required to ensure compliance with these laws when transferring technology to nationals of certain countries (such as EAR Country Groups D:1, E1, and E2). These requirements apply to persons located in the U.S. and all countries outside the U.S. As the position offered will have direct and/or indirect access to information, systems, or technologies subject to these laws, the offer may be contingent upon your citizenship/permanent residency status or ability to obtain prior license approval from the U.S. Commerce Department or applicable federal agency. If employment is not possible due to U.S. export laws, any offer of employment will be rescinded.
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