Lead Signal Integrity and Power Integrity (SIPI) Package Engineer

We are seeking a dynamic and experienced Lead Signal Integrity and Power Integrity (SIPI) Engineer to join our Packaging team, driving innovation in high-performance AI hardware solutions.

As the Lead SIPI Engineer, you will drive the signal and power integrity architecture, design, and optimization for our advanced chiplet-based AI hardware. You will lead a team of engineers, collaborate with cross-functional stakeholders, and drive initiatives to ensure robust, high-performance package designs. This role combines technical expertise, leadership, and innovation to shape the future of AI hardware at Tenstorrent.

This role is hybrid, preferably based in Toronto, ON, or Austin, TX.

We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting.

Responsibilities:

• Build and run simulations of our high-speed signals and power delivery network
• Lead, mentor, and develop a team of SIPI engineers,  enforcing a culture of technical excellence, collaboration, and innovation.
• Ensure timely delivery of high-quality SIPI design
• Work closely with package designer to iterate through different design explorations
• Partner with Silicon Architecture, PCB Design, System Integration, and Product teams to build comprehensive simulation models and validate designs.
• Identify and champion new technologies, methodologies, and tools to advance SIPI capabilities.
• Lead proof-of-concept projects to explore innovative solutions for high-power, high-speed chiplet designs.

Experience & Qualifications:

• Minimum of 10 years of experience in signal and power integrity analysis for high-power electronics
• Proven track record in SIPI design for complex, high-speed, or chiplet-based systems, ideally in AI or HPC hardware.
• Deep understanding of SIPI fundamentals
• Proficiency with industry-standard simulation tools
• Familiarity with advanced packaging technologies (e.g., 2.5D/3D ICs, chiplets) is highly desirable.
• Strong problem-solving skills, with the ability to break down complex challenges and drive creative solutions.
• Excellent communication and interpersonal skills to collaborate effectively with cross-functional teams and present to senior leadership.
• Comfortable navigating ambiguity, adapting to evolving requirements, and driving clarity in dynamic environments.

Compensation for all engineers at Tenstorrent ranges from $100k - $500k including base and variable compensation targets. Experience, skills, education, background and location all impact the actual offer made.

Tenstorrent offers a highly competitive compensation package and benefits, and we are an equal opportunity employer.

Due to U.S. Export Control laws and regulations, Tenstorrent is required to ensure compliance with licensing regulations when transferring technology to nationals of certain countries that have been licensing conditions set  by the U.S. government.

Our engineering positions and certain engineering support positions require access to information, systems, or technologies that are subject to U.S. Export Control laws and regulations, please note that citizenship/permanent residency, asylee and refugee information and/or documentation will be required and considered as Tenstorrent moves through the employment process.

If a U.S. export license is required, employment will not begin until a license with acceptable conditions is granted by the U.S. government.  If a U.S. export license with acceptable conditions is not granted by the U.S. government, then the offer of employment will be rescinded.