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Kandou AI

Advanced R&D - Physical Design Engineer

Posted 11 Days Ago
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Hybrid
Saint-Sulpice, QC
Senior level
Hybrid
Saint-Sulpice, QC
Senior level
Own block-level physical implementation for advanced FinFET semiconductor designs, including synthesis, SDC constraints, floorplanning, placement, clock-tree synthesis, routing, MCMM timing closure, ECOs, and physical verification sign-off. Collaborate with digital design teams to resolve implementation bottlenecks, automate flows with Tcl and Python, and prepare tape-out documentation. The role requires advanced-node tape-out experience, low-power implementation expertise, and proficiency with industry-standard EDA tools.
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At Kandou, we are redefining the economics of AI infrastructure. Our mission is to democratise AI by significantly reducing the Total Cost of Ownership (TCO) of hardware systems — a critical barrier to scalable adoption.

Our proprietary MIMO-over-copper technology powers a high-performance, chiplet-based AI memory fabric that is both scalable and energy-efficient. Unlike traditional interconnects, our solution reduces power consumption significantly while preserving high bandwidth and ultra-low latency — unlocking unprecedented efficiency for AI training and inference at scale.

Job title: Advanced R&D - Physical Design Engineer

Location : Lausanne, Switzerland

The Physical Design (PD) Engineer translates high-speed communication IP digital designs into physical GDSII layouts for advanced FinFET nodes. You will bridge logic design, owning block-to-chip implementation from netlist to final physical sign-off, ensuring PPA (Power, Performance, and Area) targets are met.

 

Immediate key objective

  • Drive block-level physical implementation—covering synthesis, SDC constraints, floorplanning, placement, CTS, and routing—meeting strict frequency, area, and power targets.

  • Execute timing closure across multiple corners and modes (MCMM) utilizing static timing analysis (STA) and generating targeted ECOs.

  • Drive full physical verification closure sign-off in deep-submicron FinFET technologies.

Responsibility

  • Own block synthesis, floorplanning, placement optimization, CTS, and routing.

  • Develop and refine SDC constraints to ensure design intent matches physical realization.

  • Collaborate with the digital design team to resolve logic or architectural bottlenecks affecting P&R convergence.

  • Generate progress reports, document implementation flows, and prepare sign-off packages for tape-out.

Required Experience

  • 5+ years of hands-on physical design experience focusing on synthesis, SDC constraints, CTS, and place and route for high-speed systems.

  • Strong technical background in deep-submicron CMOS/FinFET physical effects, crosstalk, and high-frequency clock network design.

  • Proven experience of taking complex blocks from netlist through successful physical implementation.

  • Direct experience with advanced low-power implementation techniques (UPF, power gating).

  • Proven tape-out experience in advanced FinFET nodes (e.g., 7nm, 5nm, or 3nm).

  • Experience handling complex block-to-chip hierarchical assembly, pin placement, and top-level routing constraints..

Required Skills

  • Expert proficiency with industry-standard implementation and sign-off tools (e.g., Cadence Genus/Innovus/Tempus or Synopsys Design Compiler/ICC2/PrimeTime, and Calibre).

  • Deep understanding of SDC creation, and MCMM timing management.

  • Strong scripting skills (Tcl, Python) for flow automation and design data analysis.

  • Analytical mindset to debug congestion routing issues, and complex timing violations.

  • Self-motivated with strong sense of ownership; effective communicator and team player

Required Education

  • Masters or Ph.D. in E.E., Communications or other relevant fields

https://kandou.ai/

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